| Issue |
EPJ Photovolt.
Volume 15, 2024
Special Issue on ‘EU PVSEC 2023: State of the Art and Developments in Photovoltaics’, edited by Robert Kenny and João Serra
|
|
|---|---|---|
| Article Number | 11 | |
| Number of page(s) | 7 | |
| DOI | https://doi.org/10.1051/epjpv/2024008 | |
| Published online | 09 April 2024 | |
https://doi.org/10.1051/epjpv/2024008
Original Article
Aging tests of mini-modules with copper-plated heterojunction solar cells and pattern-transfer-printing of copper paste
1
CSEM PV-Center, Jaquet-Droz 1, 2000 Neuchâtel, Switzerland
2
CEA INES, 50 Av. du Lac Léman, 73370 Le Bourget-du-Lac, France
3
AMAT, Via Postumia Ovest, 244, 31048 Olmi TV, Italy
4
DR Utilight, HaYarmuch St 1, Yavne, Israel
* e-mail: agata.lachowicz@csem.ch
Received:
28
September
2023
Accepted:
24
January
2024
Published online: 9 April 2024
Abstract: Mini-module aging tests with differently interconnected heterojunction solar cells having industrially viable copper metallization are presented. The plating process comprises 3 steps: firstly, screen printing of a seed-grid layout using a copper-based paste, followed by deposition of a dielectric layer over the entire wafer surface, and finally, selective copper electrodeposition on grid positions. Modules with Smartwire interconnection, fabricated with M6 half-cells, are stable in extended TC and PID tests. DH degradation is at 5% after 2700 h (glass-glass modules without edge sealing). Shingle modules, realized in collaboration with CEA INES and AMAT, exhibit notably higher fill factor compared to reference modules with screen-printed silver paste. This improvement is attributed to the superior line conductivity achieved with plated copper. TC stability of shingle modules is very good, whereas after 2000 h damp-heat aging more than 2% loss in fill factor is observed. Using pattern-transfer-printing technology narrow, high aspect-ratio lines have been obtained: with a seed-grid of pure copper paste, reinforced with electrodeposited copper. Line dimensions and line resistance as well as first cell results are presented.
Key words: Heterojunction solar cells / copper metallization / plating / module stability / pattern transfer printing / electrodeposition
© A. Lachowicz et al., Published by EDP Sciences, 2024
This is an Open Access article distributed under the terms of the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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