Illustration of the edges with (red arrow) and without (green arrow) laser groove. The top left SEM image shows a wafer edge without laser groove. The top right SEM image perpendicular to the laser pattern shows a slice through the laser groove on the rear side of the cell prior to mechanical cleaving. The bottom SEM image parallel to the laser pattern displays the edge after cleaving. The upper part, which was scribed by the laser (marked red), has a rough surface (rear side of the solar cell), while the lower part, the cleaved edge, appears similarly smooth compared to the original edge on the other side of the cell.