Table 2

Material properties used in the simulations.

Materials Density
(kg/m3)
Poisson's
ratio
CTE
(10−6/°K)
Young's modulus
(MPa)
Polycarbonate (PC) 1200 0.38 67 *
TPU 1080 0.38 200 #
Connector (Sn-Cu) 7630 0.36 20 100 000
Solder (Sn-Ag-Cu) 7000 0.35 21 45 000
Silicon 2329 0.28 2.6 170 000
Back sheet 1000 0.42 150 1210

*: hyperelastic model;

# : Viscoelastic model.

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