Table 2

Cell types and contact strips used in the small modules. The first column shows pictures of the front and back side of the cells used. Symbols: d, thickness of the coating of the contact strips. T,W, thickness and width of the contact strips, respectively. N, how many contact strips were used between two neighbouring cells. R_s,in, initial series resistance, determined from a fit of the theoretical IV-curve of the one-diode model to the data of the IV curves measured right after production of the modules. *, “tinned iron”, a core of Fe with a thin layer of Sn, whose thickness was below 1 μm.

	Module	Contact strips				Rs,in	Number of
Cell type	name	Coating d [μm]		T × W	N	[mΩ]	temperature
				[mm]			cycles
Standard	S1	SnPbAg	15	0.15 × 2.5	2	193	760
	S2	SnPbAg	15	0.20 × 2.0	2	80	760
	S3	Cu		0.20 × 2.5	2	165	796
	S4	Ag	~1	0.30 × 2.2	2	95	546
QuarterCell K	K1	Ag	6.5	0.19 × 5.0	4	114	1006
	K2	Ag	6.5	0.19 × 5.0	4	92	1006
	K3	Ag	6.5	0.25 × 5.0	3	113	493
	K4	Ag	~1	0.30 × 2.2	3	296	546
	K5	Cu		0.20 × 5.0	3	226	796
QuarterCell P	P1	SnPbAg	6.5	0.05 × 3.5	7	65	685
	P2	SnPbAg	6.5	0.05 × 3.5	7	66	685
	P3	Ag	6.5	0.05 × 5.0	7	44	685
	P4	Ag	6.5	0.05 × 5.0	7	54	685
	P5	Ag	6.5	0.19 × 2.5	3	36	796
	P6	Sn on Fe*	< 1	0.20 × 2.0	3	129	350