Table 1
Power losses of standard string and string with QuarterCells, relative to power theoretically obtainable from the string area if there were no metallization shading and no ohmic losses in the metallization. Normalized to same string length. Assumptions for standard string: Cell spacing 2 mm, cross section of Cu solder ribbons: 0.3 × 1.5 mm2.
| String with 10 | String with 42 | |
| standard cells of | QuarterCells of | |
| 156 × 156 mm | 156 × 39 mm, | |
| with three busbars | overlap 2 mm | |
|
|
||
| Area loss by bus bars | 2.9% | 0.0% |
| Area loss by cell spacing | 1.3% | 0.0% |
| Ohmic loss in bus ribbons at STC | 2.3% | ~0.0% |
| Ohmic and area loss because of | n.a. | 0.2% |
| additional metal fingers | ||
| TOTAL | 6.5% | 0.2% |
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