Tableau 2
Continued.
Synthesis method | Chalcogen and method | η (%) | I sc | V oc | FF |
of insertion | (mA/cm2) | (mV) | (%) | ||
|
|||||
Sputtering of Cu/ZnSn/Cu [108] | Annealing 30 min 560 °C | 4.6 | 15.4 | 545 | 55 |
|
|||||
Metallic precursors in alcohol [99] | Thermal treatment | 4.2 | 23.2 | 305 | 55 |
in Se atmosphere | |||||
|
|||||
Metal chlorines in dimethyl sulfoxide [145] | Thiourea in solution and | 4.1 | 24.9 | 400 | 41 |
Se atmosphere, 500 °C | |||||
|
|||||
Fast coevaporation (~20 min) of Cu, Sn, ZnS [75] | Cracked sulfur | 4.1 | 13.0 | 541 | 60 |
during evaporation | |||||
|
|||||
Cosputtering of Cu, Sn, Zn [146]. | S in sealed glass tube | 3.7 [146] | 16.5 | 425 | 53 |
Variations with Cu/Sn, Zn and Cu/Sn, | |||||
ZnS [147, 148] and with Se | |||||
thermal treatment [149] | |||||
|
|||||
One-step electrodeposition of metals [16, 62, 85, 104, 150, 151, 152, 153]. | H2S in Ar at 550 °C | 3.4 [62] | 14.8 | 563 | 41 |
One-step electrodeposition (including sulfur) [154, 155, 156, 157] | for the record. Other | ||||
techniques includes S in Ar, | |||||
H2S in Ar, S in N2, | |||||
Se and H2 | |||||
|
|||||
Reactive cosputtering of Cu, Zn, Sn in H2S/Ar [30] | 50% H2S / Ar mixture at 5 mtorr | 3.4 | 12.4 | 428 | 64 |
|
|||||
Sequential sputtering of Cu, Zn, Sn [158] | Se vapors at 500 °C for 30 min | 3.2 | 20.7 | 359 | 43 |
|
|||||
PLD from CZTS based on sintered Cu2S, ZnS | S in the CZTS pellets | 3.14 | 8.8 | 651 | 55 |
and SnS2. N2 thermal treatment | |||||
at 500 °C during 1 h [159, 160, 161, 162] | |||||
|
|||||
Sol-gel solution | H2S 3% in N2 | 2.23 | 10.2 | 529 | 42 |
(metals/methoxyethanol) [91, 163]. | |||||
|
|||||
Nanoparticles on flexible Al foil, | 1.94 | ||||
ZnS as buffer layer [118] | |||||
|
|||||
Successive ionic layer adsorption and reaction S | 1.85 | 3.2 | 280 | 62 | |
(SILAR) [164, 165] (measurements at 30 mW/cm°) | |||||
|
|||||
Sequential e-beam evaporation of Cu, Zn, Sn [166] | S vapors for 2h at 560 °C | 1.7 | 9.78 | 478 | 38 |
|
|||||
Reactive sputtering from Cu2ZnSn | H2S plasma | 1.35 | 9.52 | 0.343 | 41 |
target [167, 168] | |||||
|
|||||
Chemical bath deposition of SnS, ZnS, | H2S | 0.16 | 2.4 | 210 | 31 |
Cu ion exchange [169] | at 500 °C for 2 h | ||||
|
|||||
Evaporation from a quaternary source [170] | 0.36 |
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