Tableau 2

Continued.

Synthesis method Chalcogen and method η (%) I sc V oc FF
of insertion (mA/cm2) (mV) (%)

Sputtering of Cu/ZnSn/Cu [108] Annealing 30 min 560 °C 4.6 15.4 545 55

Metallic precursors in alcohol [99] Thermal treatment 4.2 23.2 305 55
in Se atmosphere

Metal chlorines in dimethyl sulfoxide [145] Thiourea in solution and 4.1 24.9 400 41
Se atmosphere, 500 °C

Fast coevaporation (~20 min) of Cu, Sn, ZnS [75] Cracked sulfur 4.1 13.0 541 60
during evaporation

Cosputtering of Cu, Sn, Zn [146]. S in sealed glass tube 3.7 [146] 16.5 425 53
Variations with Cu/Sn, Zn and Cu/Sn,
ZnS [147, 148] and with Se
thermal treatment [149]

One-step electrodeposition of metals [16, 62, 85, 104, 150, 151, 152, 153]. H2S in Ar at 550 °C 3.4 [62] 14.8 563 41
One-step electrodeposition (including sulfur) [154, 155, 156, 157] for the record. Other
techniques includes S in Ar,
H2S in Ar, S in N2,
Se and H2

Reactive cosputtering of Cu, Zn, Sn in H2S/Ar [30] 50% H2S / Ar mixture at 5 mtorr 3.4 12.4 428 64

Sequential sputtering of Cu, Zn, Sn [158] Se vapors at 500 °C for 30 min 3.2 20.7 359 43

PLD from CZTS based on sintered Cu2S, ZnS S in the CZTS pellets 3.14 8.8 651 55
and SnS2. N2 thermal treatment
at 500 °C during 1 h [159, 160, 161, 162]

Sol-gel solution H2S 3% in N2 2.23 10.2 529 42
(metals/methoxyethanol) [91, 163].

Nanoparticles on flexible Al foil, 1.94
ZnS as buffer layer [118]

Successive ionic layer adsorption and reaction S 1.85 3.2 280 62
(SILAR) [164, 165] (measurements at 30 mW/cm°)

Sequential e-beam evaporation of Cu, Zn, Sn [166] S vapors for 2h at 560 °C 1.7 9.78 478 38

Reactive sputtering from Cu2ZnSn H2S plasma 1.35 9.52 0.343 41
target [167, 168]

Chemical bath deposition of SnS, ZnS, H2S 0.16 2.4 210 31
Cu ion exchange [169] at 500 °C for 2 h

Evaporation from a quaternary source [170] 0.36

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