Fig. 1
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Visual representation of the defects investigated. a) EL image of a module with cell cracks. b) EL image of a module with degraded cell interconnects. c) EL image of a module with PID. d) EL image of a module with two short-circuited bypass diodes. e) Visual image of a module with glass cracks. f) Visual image of modules with soiling type 1 and 2.
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